G-X100 is a full-featured spatial computing MR chip applicable to XR devices, embodied robots and other fields. It delivers industry-leading low-latency performance for color see-through with an end-to-end latency of 9ms, and supports ultra-high-definition 8K/120Hz mixed reality (MR) display output. G-X100 also supports dual-channel 16MP RGB input and image processing, as well as 13-channel multi-type sensor data input and fusion processing.

G-VX100 is a dedicated hardware chip for AI/AR, which can be applied to a variety of intelligent products such as ultra-light AI/AR glasses, AI earphones, and portable AI agents. G-VX100 can connect to four cameras simultaneously, supporting 16MP photography, 4K@30fps video recording, ultra-low power consumption shooting at 260mW, and ultra-fast capture within 200ms. Thanks to its shortest single-side length of 4.2mm, the chip can be placed at the nose bridge of smart glasses.

G-EB100 is a dedicated chip for spatial rendering and display, applicable to scenarios such as MR headset reverse perspective and 3D front-face of embodied robots. It features low-power real-time 3D model reconstruction and driving capabilities, supporting multi-view parallel rendering and multi-layer overlay, and is equipped with PCIE, USB 3.0, and MIPI interfaces. G-EB100 has been adopted in products of several well-known enterprises.