CN
  • First full-featured spatial
    computing     chip
  • First spatially computing chip with
    heterogeneous packaging based on
    Chiplet architecture
  • World Record: The chip achieves
    video see through latency of 9ms
  • Equivalent spatial
    computing     performance
    of 200 TOPS and storage
    bandwidth of 70 GB/s
  • Enabling miniaturized full-featured
    spatial computing devices with power consumption as low as 3W
  • First to support optimal split computing,
    compatible with cross-chip platforms and
    cross-OS software ecosystems
  • Full-Link Foveated
    Rendering technology for MR
  • Universal Spatial
    Computing Ecosystem
    Supports multiple spatial computing terminals and AP architecturesFlexible computing power deployment solutionsComplete development, production, and debugging toolchain
  • Advanced Process
    Low-power Chiplet architecture
  • 40 TOPS NPU
    (AI-Enabled)
    Supported functions:
    Eye tracking
    Hand tracking
    Display
    ISP
    edge-side small models
  • Micro-OLED
    Image Optimization
    Algorithm
  • Reverse Perspective
    & Digital Human
    Multi-view parallel rendering and
    multi-layer hybrid display
  • Natural Eye-Hand
    Interaction
    Supports multiple interaction methods:
    Eye tracking, Hand tracking, etc.
  • Dual 16MP
    RGB camera input and image processing
  • 8K/120Hz
    Ultra-high-definition mixed reality display output
  • 13 Channels of
    Multi-Type Sensor
    Fusion
  • 6DoF
    Supports multiple spatial positioning
    algorithms
  • 9ms
    Lowest VST Latency
  • 10-Core DSP
  • Real-Time Depth
    & 3D Reconstruction

Instant Video See-through

9ms VST Latency,No Motion Sickness
Perceptually Seamless Video See-Through
9ms World's Lowest P2P Latency

  • Stunning Visual Fidelity

    Display & Fusion System
    8K 120Hz display output
    Professional Micro-OLED display pipeline
    High-definition HDR pipeline
    Physical fusion engine
    Seamless Immersion Adjustment

  • Omniscient Perception

    Perception Subsystem
    Dual 16MP RGB cameras
    13-channel sensors
    10-core DSP
    40 TOPS NPU
    Spatial positioning & 3D perception
    Spatial hand-eye interaction

Robotics Remote Vision & Operation

Windows MR